K60P100M100SF2 datasheet(21/73 Pages) FREESCALE

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4. 15pF load

5.3 Thermal specifications

5.3.1 Thermal operating requirements

Table 9. Thermal operating requirements

Symbol

Description

Min.

Max.

Unit

Die junction temperature

–40

125

°C

Ambient temperature

–40

105

°C

5.3.2 Thermal attributes

Board

type

Symbol Description

100

LQFP

MAPBGA

LQFP

Unit

Notes

Single-

layer (1s)

RθJA

Thermal resistance, junction to ambient

(natural convection)

TBD

°C/W

Four-

layer

(2s2p)

RθJA

Thermal resistance, junction to ambient

(natural convection)

TBD

°C/W

Single-

layer (1s)

RθJMA

Thermal resistance, junction to ambient

(200 ft./min. air speed)

TBD

°C/W

Four-

layer

(2s2p)

RθJMA

Thermal resistance, junction to ambient

(200 ft./min. air speed)

TBD

°C/W

—

RθJB

Thermal resistance, junction to board

TBD

°C/W

—

RθJC

Thermal resistance, junction to case

TBD

°C/W

—

ΨJT

Thermal characterization parameter,

junction to package top outside center

(natural convection)

TBD

°C/W

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method

Environmental Conditions—Forced Convection (Moving Air).

6 Peripheral operating requirements and behaviors

All digital I/O switching characteristics assume:

1. output pins

• have CL=30pF loads,

Peripheral operating requirements and behaviors

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

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