ZXTPS720MC

Document Number DS31938 Rev. 2 - 2

4 of 10

www.diodes.com

January 2010

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXTPS720MC

Maximum Ratings, Schottky Diode

Parameter

Symbol

Limit

Unit

Continuous Reverse Voltage

40

V

425

mV

Forward Current

1850

mA

Average Peak Forward Current D=50%

3

A

Non Repetitive Forward Current t

≤ 100µs

t

≤ 10ms

12

7

A

A

Thermal Characteristics, Schottky Diode

Characteristic

Symbol

Value

Unit

Linear Derating Factor

1.2

12

W

mW/

°C

Linear Derating Factor

2

20

W

mW/

°C

Linear Derating Factor

0.8

8

W

mW/

°C

Linear Derating Factor

0.9

9

W

mW/

°C

Linear Derating Factor

1..36

13.6

W

mW/

°C

Linear Derating Factor

2.4

24

W

mW/

°C

Junction to Ambient (Notes a and f)

83

°C/W

Junction to Ambient (Notes b and f)

51

°C/W

Junction to Ambient (Notes c and f)

125

°C/W

Junction to Ambient (Notes d and f)

111

°C/W

Junction to Ambient (Notes d and g)

73.5

°C/W

Junction to Ambient (Notes e and g)

41.7

°C/W

Junction Temperature

125

°C

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

a. For a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper

area is split down the centre line into two separate areas with one half connected to each half of the dual device.

b. Measured at t <5 secs for a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads

attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

c. For a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with minimal lead connections only.

d. For a dual device surface mounted on 10 sq cm single sided 1 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

e. For a dual device surface mounted on 85 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

f. For a dual device with one active die.

g. For dual device with 2 active die running at equal power.