SM802108 datasheet(4/11 Pages) MICREL

4 / 11 page

Micrel, Inc.

SM802108

January 2011

M9999-012111-A

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Supply Voltage (VDD, VDDOx) ........................................+4.6V

Input Voltage (VIN).............................. –0.50V to VDD + 0.5V

Lead Temperature (soldering, 20sec.)....................... 260°C

Case Temperature ..................................................... 115°C

Storage Temperature (Ts) .........................–65°C to +150°C

Operating Ratings

(2)

Supply Voltage (VDD, VDDOx) ................. +2.375V to +3.465V

Ambient Temperature (TA) .......................... –40°C to +85°C

Junction Thermal Resistance

(3)

QFN (

θJA)

Still-Air.........................................................50°C/W

QFN (

ψJB)

Junction-to-Board .......................................30°C/W

DC Electrical Characteristics

(4)

VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%

VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%

TA = −40°C to +85°C.

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

VDD, VDDOx

2.5V Operating Voltage

2.375

2.5

2.625

VDD, VDDOx

3.3V Operating Voltage

3.135

3.3

3.465

IDD

Supply current VDD + VDDO

Outputs open; REF_IN source,

XTAL_SEL = 0

130

165

IDD

Supply current VDD + VDDO

Outputs open; CRYSTAL source,

XTAL_SEL = 1

145

185

LVPECL DC Electrical Characteristics

(4)

VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%

VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%

TA = −40°C to +85°C. RL = 50Ω to VDDO − 2V

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

VOH

Output High Voltage

VDDO – 1.145

VDDO – 0.97

VDDO – 0.845

VOL

Output Low Voltage

VDDO – 1.945

VDDO – 1.77

VDDO – 1.645

VSWING

Output Voltage Swing

0.6

0.8

1.0

Note:

Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.

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