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MPC8360E bảng dữ liệu(PDF) 68 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8360E
Giải thích chi tiết về linh kiện  PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
PDF  108 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC8360E bảng dữ liệu(HTML) 68 Page - Freescale Semiconductor, Inc

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
68
Freescale Semiconductor
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is
available in a tape ball grid array (TBGA), see Section 21.1, “Package Parameters for the TBGA Package,”
and Section 21.2, “Mechanical Dimensions of the TBGA Package,” for information on the package.
21.1
Package Parameters for the TBGA Package
The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is
37.5 mm
× 37.5 mm, 740 tape ball grid array (TBGA).
Package outline
37.5 mm
× 37.5 mm
Interconnects
740
Pitch
1.00 mm
Module height (typical)
1.46 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
Ball diameter (typical)
0.64 mm



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