MMSZ5221B datasheet(1/5 Pages) DIODES

tên linh kiện	MMSZ5221B

Giải thích chi tiết về linh kiện	500mW SURFACE MOUNT ZENER DIODE

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nhà sản xuất	DIODES [Diodes Incorporated]

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MMSZ5221B - MMSZ5259B

Document number: DS18010 Rev. 23 - 2

1 of 5

www.diodes.com

May 2009

MMSZ5221B - MMSZ5259B

500mW SURFACE MOUNT ZENER DIODE

Features

•

500mW Power Dissipation

•

General Purpose, Medium Current

•

Ideally Suited for Automated Assembly Processes

•

Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)

•

"Green" Device (Note 4)

•

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

•

Case: SOD-123

•

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Polarity: Cathode Band

•

Ordering Information: See Page 3

•

Marking Information: See Page 3

•

Weight: 0.01 grams (approximate)

Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage

@ IF = 10mA

VF

0.9

V

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 1) @TL = 75°C

PD

500

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

RθJA

350

°C/W

Thermal Resistance, Junction to Lead (Note 2)

RθJL

150

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-65 to +150

°C

Notes:

1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.

2. Thermal Resistance measurement obtained via infrared scan method.

3. No purposefully added lead. Halogen and Antimony Free.

4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

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