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ZXMS6006DT8 bảng dữ liệu(PDF) 3 Page - Diodes Incorporated |
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ZXMS6006DT8 bảng dữ liệu(HTML) 3 Page - Diodes Incorporated |
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3 / 9 page ![]() ZXMS6006DT8 Document number: DS35143 Rev. 1 - 2 3 of 9 www.diodes.com December 2010 © Diodes Incorporated ZXMS6006DT8 A Product Line of Diodes Incorporated IntelliFET ® is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide. Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Continuous Drain-Source Voltage VDS 60 V Drain-Source Voltage For Short Circuit Protection VDS(SC) 16 V Continuous Input Voltage VIN -0.5 ... +6 V Continuous Input Current @-0.2V ≤ VIN ≤ 6V Continuous Input Current @VIN < -0.2V or VIN > 6V IIN No limit │IIN │≤2 mA Pulsed Drain Current @VIN = 3.3V ( Note 6) IDM 11 A Pulsed Drain Current @VIN = 5V ( Note 6) IDM 13 A Continuous Source Current (Body Diode) (Note 4) IS 2 A Pulsed Source Current (Body Diode) ISM 12 A Unclamped Single Pulse Inductive Energy, TJ = 25°C, ID = 0.5A, VDD = 24V EAS 210 mJ Electrostatic Discharge (Human Body Model) VESD 4000 V Charged Device Model VCDM 1000 V Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Value Units Power Dissipation at TA = 25°C (Notes 4 & 7) Linear Derating Factor PD 1.16 9.28 W mW/ °C Power Dissipation at TA = 25°C (Notes 4 & 8) Linear Derating Factor PD 1.67 13.3 W mW/ °C Power Dissipation at TA = 25°C (Notes 5 & 7) Linear Derating Factor PD 2.13 17 W mW/ °C Thermal Resistance, Junction to Ambient (Notes 4 & 7) RθJA 108 °C/W Thermal Resistance, Junction to Ambient (Notes 4 & 8) RθJA 75 °C/W Thermal Resistance, Junction to Case (Notes 5 & 7) RθJC 58.7 °C/W Thermal Resistance, Junction to Case (Note 9) RθJC 26.5 °C/W Operating Temperature Range TJ -40 to +150 °C Storage Temperature Range TSTG -55 to +150 °C Notes: 4. For a dual device surface mounted on a 25mm x 25mm single sided 1oz weight copper split down the middle on 1.6mm FR4 board, in still air conditions. 5. For a dual device surface mounted on FR4 PCB measured at t ≤ 10sec 6. Repetitive rating25mm x 25mm FR4 PCB, D = 0.02, Pulse width = 300µs – pulse width limited by junction temperature. Refer to transient thermal impedance graph. 7. For a dual device with one active die. 8. For a dual device with 2 active die running at equal power. 9. Thermal resistance from junction to the mounting surface of the drain pin. |
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