iC-MA

ANGULAR HALL SENSOR / ENCODER

Rev B3, Page 3/18

PACKAGES DFN10 according to the JEDEC standard

PIN CONFIGURATION - DFN10 4 mm x 4 mm

iC-MA

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6

9

7

8

10

5

2

4

3

1

PIN FUNCTIONS

No. Name Function

1 NEN

Enable Input, low active

2 GND

Ground

3 CFG2 Configuration Input 2

4 B

Bidirectional Input/Output B

5 A

Bidirectional Input/Output A

6 D

Bidirectional Input/Output D

7 C

Bidirectional Input/Output C

8 CFG3 Configuration Input 3

9 VDD

+5 V Supply Voltage

10 CFG1 Configuration Input 1

The Thermal Pad on the bottom of the package should be connected to Ground (GND) on the PCB.

Orientation of package label (

MA CODE ...) may vary.

PIN CONFIGURATION - Die

2.74 mm x 1.94 mm

1

2

3

4

5

6

7

8

9

10

PIN FUNCTIONS

No. Name Function

1 NEN

Enable Input, low active

2 GND

Ground

3 CFG2 Configuration Input 2

4 B

Bidirectional Input/Output B

5 A

Bidirectional Input/Output A

6 D

Bidirectional Input/Output D

7 C

Bidirectional Input/Output C

8 CFG3 Configuration Input 3

9 VDD

+5 V Supply Voltage

10 CFG1 Configuration Input 1