Obsolete

Product(s)

- Obsolete

Product(s)

TDA8133

Power dissipation and layout indications

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5

Power dissipation and layout indications

The power is mainly dissipated by the two device buffers. It can be calculated by the

equation:

sink and the corresponding maximum power dissipation assuming:

●

Maximum ambient temperature = 70° C

●

Maximum junction temperature = 140° C

Figure 8.

Thermal resistance (junction-to-ambient) for DIP16 package without heatsink

Figure 9.

Metal plate mounted near the TDA8133D for heatsinking

Table 5.

Power dissipation

Device

Heat Sink

TDA8133

No

50

1.4

Yes

20

3.5

TDA8133D

No

56 to 40

1.25 to 1.75

Yes

32

2.2

Copper area (cm²) (35 µm plus solder) board is face-down

To optimize the thermal conductivity of the copper

layer and the exchanges with the air, the solder

must cover the maximum amount of this area

60

40

50

10

12

0

55

45

24

8

6

Test board with

“on board” square heat sink area

Top View

Bottom View