IRFN250

2N7225U1

Document Number 3352

Issue 2

Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed

to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.

Semelab encourages customers to verify that datasheets are current before placing orders.

Gate – Source Voltage

Continuous Drain Current

Continuous Drain Current

Linear Derating Factor

dv/dt

Operating and Storage Temperature Range

Package Mounting Surface Temperature (for 5 sec)

Thermal Resistance Junction to Case

±20V

27.4A

17A

110A

150W

1.2W/°C

500mJ

5.0V/ns

–55 to 150°C

300°C

0.83°C/W

MECHANICAL DATA

Dimensions in mm (inches)

3. 60 ( 0. 142)

Ma x .

3. 70 ( 0. 146)

3. 41 ( 0. 134)

3. 70 ( 0. 146)

3. 41 ( 0. 134)

0. 89

( 0 . 035)

mi n .

9. 67 ( 0. 381)

9. 38 ( 0. 369)

11. 58 ( 0 . 4 56)

11. 28 ( 0 . 4 44)

0. 50 ( 0. 020 )

0. 26 ( 0. 010 )

13

2

SMD 1 PACKAGE (TO-276AB)

Notes 1) Pulse Test: Pulse Width

≤ 300ms, δ≤ 2%

N–CHANNEL

POWER MOSFET

FEATURES

• HERMETICALLY SEALED SURFACE

MOUNT PACKAGE

• SMALL FOOTPRINT – EFFICIENT USE OF

PCB SPACE.

• SIMPLE DRIVE REQUIREMENTS

• LIGHTWEIGHT

• HIGH PACKING DENSITIES

Pad 1 – Source

Pad 2 – Drain

Pad 3 – Gate

Note:

IRF250SMD also available with

pins 1 and 3 reversed.

200V

27.4A

0.100

Ω

Ω