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F1206A0R20FSTR bảng dữ liệu(PDF) 16 Page - AVX Corporation |
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F1206A0R20FSTR bảng dữ liệu(HTML) 16 Page - AVX Corporation |
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16 / 23 page ![]() Accu-Guard® SMD Thin-Film Fuse RECOMMENDED SOLDERING PROFILES IR REFLOW CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thor- oughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lousy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids . . . . . . . .i-propanol, ethanol, acetylace- tone, water, and other stan- dard PCB cleaning liquids. Ultrasonic conditions . . . .power – 20w/liter max. fre- quency – 20kHz to 45kHz. Temperature . . . . . . . . . .80°C maximum (if not other- wise limited by chosen solvent system). Time . . . . . . . . . . . . . . . .5 minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-Guard® prior to use are as follows: Temperature 15°C to 35°C Humidity ≤65% Air Pressure 860mbar to 1060mbar VAPOR PHASE 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 00.5 11.5 22.5 33.5 44.5 Assembly enters the preheat zone Additional soak time to allow uniform heating of the substrate Soak time 1) Activates the flux 2) Allows center of board temperatures to catch up with corners 45-60 sec. above solder melting point Assembly exits heat– no forced cooldown 186 °C solder melting temperature Time (mins) 0 20 40 60 80 100 120 140 160 180 200 215 °C Time (minutes) Preheat Transfer from preheat with min. delay & temp. loss 0 20 40 60 80 100 120 140 160 180 215 °C Time (seconds) Reflow Enter Vapor Natural Cooling Duration varies with thermal mass of assembly 10–60 secs typical 10 20 30 40 50 60 70 200 0 2030405060708090 100 110 120 260 240 220 200 180 160 140 120 100 80 60 40 20 Time (seconds) Enter Wave Natural Cooling 100 °C 3–5 seconds 10 WAVE SOLDERING |
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