ADP5587ACBZ-R7 datasheet(23/24 Pages) AD

23 / 24 page

ADP5587

Rev. B | Page 23 of 24

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.20

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.20

2.10 SQ

2.00

Figure 21. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-24-1)

Dimensions shown in millimeters

0.645

0.600

0.555

0.230

0.200

0.170

2.010

1.970 SQ

1.930

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.287

0.267

0.247

SEATING

PLANE

COPLANARITY

0.05

0.40

REF

1.60

REF SQ

0.022

REF

0.395

0.375

0.355

BALL A1

IDENTIFIER

Figure 22. 25-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-25-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP5587ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-24-1

ADP5587ACBZ-R7

−40°C to +85°C

25-Ball Wafer Level Chip Scale Package [WLCSP]

CB-25-4

Z = RoHS Compliant Part.

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