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MSC8256 bảng dữ liệu(PDF) 24 Page - Freescale Semiconductor, Inc |
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MSC8256 bảng dữ liệu(HTML) 24 Page - Freescale Semiconductor, Inc |
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24 / 68 page ![]() MSC8256 Six-Core Digital Signal Processor Data Sheet, Rev. 1 Electrical Characteristics Freescale Semiconductor 24 2.2 Recommended Operating Conditions Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed. Table 3. Recommended Operating Conditions Rating Symbol Min Nominal Max Unit Core supply voltage VDD 0.97 1.0 1.05 V M3 memory supply voltage VDDM3 0.97 1.0 1.05 V DDR memory supply voltage • DDR2 mode • DDR3 mode DDR reference voltage VDDDDR MVREF 1.7 1.425 0.49 × VDDDDR 1.8 1.5 0.5 × VDDDDR 1.9 1.575 0.51 × VDDDDR V V V I/O voltage excluding DDR and RapidIO lines VDDIO 2.375 2.5 2.625 V Rapid I/O pad voltage VDDSXP 0.97 1.0 1.05 V Rapid I/O core voltage VDDSXC 0.97 1.0 1.05 V Operating temperature range: • Standard • Higher • Extended TJ TJ TA TJ 0 0 –40 — 90 105 — 105 °C °C °C Typical power: • 1 GHz at 1.0 V1 • 800 MHz at 1.0 V2 P — — 6.04 5.53 — — W W Notes: 1. The typical power values are derived for a device running under the following conditions. • Six cores running at 1 GHz, Core voltage at 1 V, 75% utilization (50% control/50% DSP). • A single 64 bit DDR3 running at 800 MHz, 50% utilization (50% reads/50% writes). • M3 Memory 50% utilized, PCI Express controller disabled, TDM enabled 20% loading, Serial RapidIO controller disabled. • 1 RGMII at 1 Gbps 50% loading. • A junction temperature of 60°C. 2. The typical power values are derived for a device running under the following conditions. • Six cores running at 800 MHz, Core voltage at 1 V, 75% utilization (50% control/50% DSP). • A single 64 bit DDR3 running at 800 MHz, 50% utilization (50% reads/50% writes). • M3 Memory 50% utilized, PCI Express controller disabled, TDM enabled 20% loading, Serial RapidIO controller disabled. • 1 RGMII at 1 Gbps 50% loading. • A junction temperature of 60°C. |
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