MPXV4006 datasheet(6/22 Pages) FREESCALE

6 / 22 page

MPXV4006

Sensors

Freescale Semiconductor

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing a gel die coat which

isolates the die from the environment. The pressure sensor is

designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 6. SOP Footprint (Case 482)

Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table

Part Number

Case Type

Pressure (P1) Side Identifier

MPVZ4006GW6U

1735-01

Vertical Port Attached

MPVZ4006GW7U

1560-02

Vertical Port Attached

MPVZ4006G6U/T1

482-01

Stainless Steel Cap

MPVZ4006G7U

482B-03

Stainless Steel Cap

MPXV4006GC6U/T1

482A

Vertical Port Attached

MPXV4006GC7U

482C-03

Vertical Port Attached

MPXV4006GP

1369-01

Side with Port Attached

MPXV4006DP

1351-01

Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

inch

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