360 datasheet(27/95 Pages) INTEL

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Datasheet

Electrical Specifications

5. 0.24 V is defined at 20% of nominal VTT of 1.2 V.

6. The TAP signal group must meet the signal quality specifications.

7. The maximum output current is based on maximum current handling capability of the buffer and is

not specified into the test load.

8. Leakage to VSS with land held at VTT.

9. Leakage to VTT with land held at 300 mV.

Table 13.

VTTPWRGD DC Specifications

Symbol

Parameter

Min

Typ

Max

Unit

VIL

Input Low Voltage

—

0.3

VIH

Input High Voltage

0.9

—

Table 14.

BSEL[2:0] and VID[5:0] DC Specifications

Symbol

Parameter

Max

Unit

Notes1, 2

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. These parameters are not tested and are based on design simulations.

RON (BSEL)

Buffer On Resistance

120

RON (VID)

Buffer On Resistance

120

IOL

Max Land Current

2.4

ILO

Output Leakage Current

200

µA

3. Leakage to VSS with land held at 1.2 V.

VTOL

Voltage Tolerance

VTT(max)

Table 15.

BOOTSELECT DC Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Notes

VIL

Input Low Voltage

—

0.24

NOTES:

1. These parameters are not tested and are based on design simulations.

VIH

Input High Voltage

0.96

—

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