430 datasheet(99/100 Pages) INTEL

99 / 100 page

Datasheet

Debug Tools Specifications

8.1

Logic Analyzer Interface (LAI)

Intel is working with two logic analyzer vendors to provide logic analyzer interfaces

(LAIs) for use in debugging systems. Tektronix and Agilent should be contacted to get

specific information about their logic analyzer interfaces. The following information is

general in nature. Specific information must be obtained from the logic analyzer

vendor.

Due to the complexity of systems, the LAI is critical in providing the ability to probe and

capture FSB signals. There are two sets of considerations to keep in mind when

designing a r system that can make use of an LAI: mechanical and electrical.

8.1.1

Mechanical Considerations

The LAI is installed between the processor socket and the processor. The LAI lands plug

into the processor socket, while the processor lands plug into a socket on the LAI.

Cabling that is part of the LAI egresses the system to allow an electrical connection

between the processor and a logic analyzer. The maximum volume occupied by the LAI,

known as the keepout volume, as well as the cable egress restrictions, should be

obtained from the logic analyzer vendor. System designers must make sure that the

keepout volume remains unobstructed inside the system. Note that it is possible that

the keepout volume reserved for the LAI may differ from the space normally occupied

by the processor’s heatsink. If this is the case, the logic analyzer vendor will provide a

cooling solution as part of the LAI.

8.1.2

Electrical Considerations

The LAI will also affect the electrical performance of the FSB; therefore, it is critical to

obtain electrical load models from each of the logic analyzers to be able to run system

level simulations to prove that their tool will work in the system. Contact the logic

analyzer vendor for electrical specifications and load models for the LAI solution it

provides.

430 bảng dữ liệu(PDF) 99 Page - Intel Corporation