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TDA8034T bảng dữ liệu(PDF) 2 Page - NXP Semiconductors |
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TDA8034T bảng dữ liệu(HTML) 2 Page - NXP Semiconductors |
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2 / 29 page ![]() TDA8034T_TDA8034AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2.0. — 12 November 2010 2 of 29 NXP Semiconductors TDA8034T; TDA8034AT Smart card interface Identification Bank card readers 4. Quick reference data [1] To meet these specifications, VCC should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of either 100 nF or one 220 nF and one 470 nF. 5. Ordering information Table 1. Quick reference data VDDP =5V; VDD =3.3 V; VDD(INTF) =3.3 V; fxtal =10MHz; GND = 0V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply VDDP power supply voltage pin VDDP 4.85 5 5.5 V VDD supply voltage pin VDD 2.7 3.3 3.6 V VDD(INTF) interface supply voltage pin VDD(INTF) 1.6 3.3 VDD +0.3 V IDD supply current Shutdown mode - - 35 μA IDDP power supply current Shutdown mode; fxtal stopped -- 5 μA Active mode; fCLK = 1∨2 fxtal; no load -- 1.5 mA IDD(INTF) interface supply current Shutdown mode - - 6 μA Card supply voltage: pin VCC[1] VCC supply voltage active mode 5V card ICC < 65 mA DC 4.75 5.0 5.25 V current pulses of 40 nA/s at ICC <200 mA; t < 400 ns 4.65 5.0 5.25 V Vripple(p-p) peak-to-peak ripple voltage from 20 kHz to 200 MHz - - 350 mV ICC supply current VCC = 0 V to 5 V or 3 V - - 65 mA General tdeact deactivation time see Figure 7 on page 10 35 90 250 μs Ptot total power dissipation Tamb = −25 °C to +85 °C- - 0.25 W Tamb ambient temperature −25 - +85 °C Table 2. Ordering information Type number Package Name Description Version TDA8034T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 TDA8034AT |
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