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TDA8034T bảng dữ liệu(PDF) 2 Page - NXP Semiconductors

tên linh kiện TDA8034T
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TDA8034T bảng dữ liệu(HTML) 2 Page - NXP Semiconductors

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TDA8034T_TDA8034AT
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2.0. — 12 November 2010
2 of 29
NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
Identification
Bank card readers
4.
Quick reference data
[1]
To meet these specifications, VCC should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of
either 100 nF or one 220 nF and one 470 nF.
5.
Ordering information
Table 1.
Quick reference data
VDDP =5V; VDD =3.3 V; VDD(INTF) =3.3 V; fxtal =10MHz; GND = 0V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply
VDDP
power supply voltage
pin VDDP
4.85
5
5.5
V
VDD
supply voltage
pin VDD
2.7
3.3
3.6
V
VDD(INTF)
interface supply voltage
pin VDD(INTF)
1.6
3.3
VDD +0.3
V
IDD
supply current
Shutdown mode
-
-
35
μA
IDDP
power supply current
Shutdown mode; fxtal
stopped
--
5
μA
Active mode;
fCLK = 1∨2 fxtal; no load
--
1.5
mA
IDD(INTF)
interface supply current
Shutdown mode
-
-
6
μA
Card supply voltage: pin VCC[1]
VCC
supply voltage
active mode
5V card
ICC < 65 mA DC
4.75
5.0
5.25
V
current pulses of
40 nA/s at
ICC <200 mA;
t < 400 ns
4.65
5.0
5.25
V
Vripple(p-p)
peak-to-peak ripple voltage
from 20 kHz to 200 MHz
-
-
350
mV
ICC
supply current
VCC = 0 V to 5 V or 3 V
-
-
65
mA
General
tdeact
deactivation time
see Figure 7 on page 10
35
90
250
μs
Ptot
total power dissipation
Tamb = −25 °C to +85 °C-
-
0.25
W
Tamb
ambient temperature
−25
-
+85
°C
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TDA8034T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
TDA8034AT



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