DS1374_10 datasheet(2/18 Pages) MAXIM

2 / 18 page

I2C, 32-Bit Binary Counter Watchdog RTC with

Trickle Charger and Reset Input/Output

_____________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED DC OPERATING CONDITIONS

(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V

Voltage Range on SDA or SCL

Relative to Ground ....................................-0.3V to VCC + 0.3V

Junction-to-Ambient Thermal Resistance (

θJA) (Note 1)

16-Pin SO .....................................................................73°C/W

10-Pin µSOP ...............................................................221°C/W

Junction-to-Case Thermal Resistance (

θJC) (Note 1)

16-Pin SO .....................................................................23°C/W

10-Pin µSOP .................................................................39°C/W

Operating Temperature Range ...........................-40

°C to +85°C

Storage Temperature Range .............................-55

°C to +125°C

Lead Temperature (soldering, 10s) .................................+260

°C

Soldering Temperature (reflow) .......................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DS1374-33

2.97

3.3

5.50

DS1374-3

2.7

3.0

3.3

Supply Voltage

(Notes 3, 4)

VCC

DS1374-18

1.71

1.8

1.89

Input Logic 1

VIH

(Note 3)

0.7 x VCC

VCC + 0.3

Input Logic 0

VIL

(Note 3)

-0.3

+0.3 x

VCC

Pullup Resistor Voltage (INT,

SQW, SDA, SCL), VCC = 0V

VPU

(Note 3)

5.5

DS1374-33

2.70

2.88

2.97

DS1374-3

2.45

2.6

2.7

Power-Fail Voltage

(Note 3)

VPF

DS1374-18

1.51

1.6

1.71

DS1374-33

1.3

3.0

VCC

(MAX)

Backup Supply Voltage

(Notes 3, 4, 5)

VBACKUP

DS1374-3, DS1374-18

1.3

3.0

3.7

Note 1:

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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