2

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FN3573.4

May 19, 2009

Pinouts

s

HS-139RH

(SBDIP CDIP2-T14)

TOP VIEW

OUT 2

OUT 1

V+

- IN 1

+ IN 1

- IN 2

+ IN 2

OUT 3

OUT 4

GND

+ IN 4

- IN 4

+ IN 3

- IN 3

1

2

3

4

5

6

7

14

13

12

11

10

9

8

HS-139RH

(FLATPACK CDFP3-F14)

TOP VIEW

14

13

12

11

10

9

8

2

3

4

5

6

7

1

OUT 2

OUT 1

V+

- IN 1

+ IN 1

- IN 2

+IN 2

OUT 3

OUT 4

GND

+ IN 4

- IN 4

+ IN 3

- IN 3

Die Characteristics

DIE DIMENSIONS:

3750µm x 2820µm (148 mils x 111 mils)

483µm

±25.4µm (19 mils ±1 mil)

INTERFACE MATERIALS:

Glassivation:

Thickness: 8.0kÅ

±1.0kÅ

Top Metallization:

Type: AlSiCu

Thickness: 16.0kÅ

±2kÅ

Substrate:

Radiation Hardened Silicon Gate, Dielectric Isolation

Backside Finish:

Silicon

ASSEMBLY RELATED INFORMATION:

Substrate Potential:

Unbiased (DI)

ADDITIONAL INFORMATION:

Worst Case Current Density:

Transistor Count:

49

HS-139RH