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LMP8602MM bảng dữ liệu(PDF) 4 Page - National Semiconductor (TI) |
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LMP8602MM bảng dữ liệu(HTML) 4 Page - National Semiconductor (TI) |
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4 / 24 page ![]() Symbol Parameter Conditions Min (Note 7) Typ (Note 5) Max (Note 7) Units TCR F-INT Output Impedance Filter Resistor Drift ±5 ±50 ppm/°C A1 V OUT A1 Ouput Voltage Swing V OL R L = ∞ 2 10 mV V OH 4.95 4.985 V Output Buffer (From A2 (pin 4) to OUT ( pin 5 ) V OS Input Offset Voltage 0V ≤ V CM ≤ VS −2 −2.5 ±0.5 2 2.5 mV K2 Gain (Note 15) LMP8602 4.975 5 5.025 V/V LMP8603 9.95 10 10.05 I B Input Bias Current of A2 (Note 11) −40 fA ±20 nA A2 V OUT A2 Ouput Voltage Swing (Note 12, Note 13) V OL, R L = 100 kΩ LMP8602 10 40 mV LMP8603 10 80 V OH, R L = 100 kΩ 4.98 4.99 V I SC Output Short-Circuit Current (Note 14) Sourcing, V IN = VS, VOUT = GND –25 –42 –60 mA Sinking, V IN = GND, VOUT = VS 30 48 65 Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of the device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: The electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T J(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation P DMAX = (TJ(MAX) - TA) / θJA or the number given in Absolute Maximum Ratings, whichever is lower. Note 4: Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per JESD22-C101- C. Note 5: Typical values represent the most likely parameter norms at T A = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Note 6: For the MSOP package, the bare board spacing at the solder pads of the package will be to small for reliable use at higher voltages (V CM >25V) Therefore it is strongly advised to add a conformal coating on the PCB assembled with the LMP8602 and LMP8603. Note 7: Datasheet min/max specification limits are guaranteed by test. Note 8: Slew rate is the average of the rising and falling slew rates. Note 9: Offset voltage drift determined by dividing the change in V OS at temperature extremes into the total temperature change. Note 10: AC Common Mode Signal is a 5V PP sine-wave (0V to 5V) at the given frequency. Note 11: Positive current corresponds to current flowing into the device. Note 12: For this test input is driven from A1 stage in uni-directional mode (Offset pin connected to GND). Note 13: For V OL, RL is connected to VS and for VOH, RL is connected to GND. Note 14: Short-Circuit test is a momentary test. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Note 15: Both the gain of the preamplifier A1 V and the gain of the buffer amplifier A2V are measured individually. The over all gain of both amplifiers AV is also measured to assure the gain of all parts is always within the A V limits. www.national.com 4 |
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