lower ground injection currents, resulting in electrically

“cleaner” grounds for the rest of the system and minimize

source ringing, resulting in more reliable gate switching

signals.

3) The connection between the junction of Q

output capacitor should be a wide trace or copper region.

It should be as short as practical. Since this connection

has fast voltage transitions, keeping this connection short

will minimize EMI.

4) The Output Capacitor(s) (C

close to the load as possible, fast transient load currents

are supplied by C

and the load must be short, wide copper areas to minimize

inductance and resistance.

5) The SC2604 is best placed over an isolated ground

plane area.The soft-start capacitor and theVin decoupling

capacitor should also connected to this ground pad

area. This isolated ground area should be connected to

the main ground by a trace that runs from the GND pin

to the ground side of the output capacitor. If this is not

possible, the GND pin may be connected to the ground

path between the Output Capacitor and the C

loop. Under no circumstances should GND be returned to

a ground inside the C

6) Input voltage of the SC2604 should be supplied from

the power rail through a Ω resistor, the Vin pin should

be decoupled directly to GND by a 0.µF~µF ceramic

capacitor, trace lengths should be as short as possible.

SC2604



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Applications Information (Cont.)

Figure 4. SC2604 Layout Diagram

Note: Heavy lines indicate the critical loop carrying high pulsating current.

The inductance of the loop needs to be minimized.