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NTMFS4841NH bảng dữ liệu(PDF) 1 Page - ON Semiconductor

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Giải thích chi tiết về linh kiện  Power MOSFET 30 V, 59 A, Single N?묬hannel, SO??FL
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© Semiconductor Components Industries, LLC, 2010
May, 2010 − Rev. 4
1
Publication Order Number:
NTMFS4841NH/D
NTMFS4841NH
Power MOSFET
30 V, 59 A, Single N−Channel, SO−8FL
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• Low RG
• These are Pb−Free Devices*
Applications
• Refer to Application Note AND8195/D
• CPU Power Delivery
• DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Sym-
bol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±20
V
Continuous Drain
Current RqJA
(Note 1)
Steady
State
TA = 25°C
TA = 85°C
ID
13.5
9.7
A
Power Dissipation
RqJA (Note 1)
TA = 25°C
TA = 85°C
PD
2.16
1.1
W
Continuous Drain
Current RqJA
v10 s
TA = 25°C
TA = 85°C
ID
21.8
15.7
A
Power Dissipation
RqJA v10 s
TA = 25°C
TA = 85°C
PD
5.7
2.9
W
Continuous Drain
Current RqJA
(Note 2)
TA = 25°C
TA = 85°C
ID
8.6
6.2
A
Power Dissipation
RqJA (Note 2)
TA = 25°C
TA = 85°C
PD
0.87
0.45
W
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
TC = 85°C
ID
59
42.5
A
Power Dissipation
RqJC (Note 1)
TC = 25°C
TC = 85°C
PD
41.7
21.7
W
Pulsed Drain
Current
tp =
10 ms
TA = 25°C
IDM
177
A
Operating Junction and Storage Temperature
TJ,
TSTG
−55 to
+150
°C
Source Current (Body Diode)
IS
35
A
Drain to Source dV/dt
dV/dt
6
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 24 V, VGS = 10 V, IL = 25.6 A,
L = 0.3 mH, RG = 25 W)
EAS
98
mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
http://onsemi.com
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
4841NH
AYWWG
G
1
V(BR)DSS
RDS(ON) MAX
ID MAX
30 V
7.0 mW @ 10 V
59 A
11.6 mW @ 4.5 V
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5,6)
Device
Package
Shipping†
ORDERING INFORMATION
NTMFS4841NHT1G
SO−8FL
(Pb−Free)
1500 /
Tape & Reel
NTMFS4841NHT3G
SO−8FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
S
S
S
G
D
D
D
D
(Note: Microdot may be in either location)
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting Tech-
niques Reference Manual, SOLDERRM/D.


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