CSPEMI201AG

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Mechanical Details

CSP Mechanical Specifications

The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For

complete information on CSP, see the California Micro Devices CSP Package Information document.

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

5

Millimeters

Inches

Dim

Min

Nom

Max

Min

Nom

Max

A1

0.885

0.930

0.975

0.0348

0.0366

0.0384

A2

1.365

1.410

1.455

0.0537

0.0555

0.0573

B1

0.495

0.500

0.505

0.0195

0.0197

0.0199

B2

0.245

0.250

0.255

0.0096

0.0098

0.0100

B3

0.430

0.435

0.440

0.0169

0.0171

0.0173

B4

0.430

0.435

0.440

0.0169

0.0171

0.0173

C1

0.165

0.215

0.265

0.0065

0.0085

0.0104

C2

0.220

0.270

0.320

0.0087

0.0106

0.0126

D1

0.562

0.606

0.650

0.0221

0.0239

0.0256

D2

0.356

0.381

0.406

0.0140

0.0150

0.0160

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

A

B

C

12

C1

B1

A1

DIMENSIONS IN MILLIMETERS

D1

D2

BOTTOM VIEW

SIDE

VIEW

3

B2

0.30 DIA.

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

Package Dimensions for

CSPEMI201AG Chip Scale Package