PC912XDP512F0CFVR datasheet(1242/1348 Pages) FREESCALE

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Appendix A Electrical Characteristics

MC9S12XDP512 Data Sheet, Rev. 2.21

1244

Freescale Semiconductor

A.1.8

Power Dissipation and Thermal Characteristics

Power dissipation and thermal characteristics are closely related. The user must assure that the maximum

operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be

obtained from:

The total power dissipation can be calculated from:

Two cases with internal voltage regulator enabled and disabled must be considered:

1. Internal voltage regulator disabled

PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.

For RDSON is valid:

respectively

2. Internal voltage regulator enabled

IDDR is the current shown in Table A-10. and not the overall current ﬂowing into VDDR, which

additionally contains the current ﬂowing into the external loads with output high.

PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.

•

()

Junction Temperature, [

°C ]

Ambient Temperature, [

°C ]

Total Chip Power Dissipation, [W]

Package Thermal Resistance, [

°C/W]

INT

Chip Internal Power Dissipation, [W]

INT

⋅

DDPLL

⋅

DDA

⋅

DSON

∑

⋅

DSON

------------ for outputs driven low

;

DSON

DD5

–

------------------------------------ for outputs driven high

;

INT

DDR

⋅

DDA

⋅

DSON

∑

⋅

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