ADT7482

http://onsemi.com

2

Figure 1. Functional Block Diagram

11−BIT ADC

RUN/STANDBY

BUSY

SRC

STATUS REGISTERS

INTERRUPT

MASKING

LOCAL TEMPERATURE

VALUE REGISTER

ON−CHIP

TEMPERATURE

SENSOR

ANALOG

MUX

EXTERNAL DIODES OPEN−CIRCUIT

SMBus INTERFACE

ADT7482

6

7

10

1

59

GND

SDATA

SCLK

8

D2+

D2–

3

2

D1+

D1–

ALERT/THERM2

CONFIGURATION

REGISTERS

LOCAL TEMPERATURE

HIGH−LIMIT REGISTER

LOCAL TEMPERATURE

LOW−LIMIT REGISTER

LOCAL TEMPERATURE

THERM−LIMIT REGISTER

CONVERSION RATE

REGISTER

ONE−SHOT

REGISTER

ADDRESS POINTER

REGISTER

4

THERM

REMOTE 1 AND 2 TEMP

VALUE REGISTERS

REMOTE 1 AND 2 TEMP

THERM−LIMIT REGISTERS

REMOTE 1 AND 2 TEMP

LOW-LIMIT REGISTERS

REMOTE 1 AND 2 TEMP

HIGH−LIMIT REGISTERS

REMOTE 1 AND 2 TEMP

VALUE REGISTERS

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3 to +3.6

V

D+

V

D− to GND

−0.3 to +0.6

V

SCLK, SDATA, ALERT, THERM

−0.3 to +3.6

V

Input Current, SDATA, THERM

−1 to +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

2000

V

150

°C

Storage Temperature Range

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260

°C

Lead Temperature, Soldering (10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

10−Lead MSOP

142

43.7

°C/W