PIC16F57-ISLASHSP datasheet(81/88 Pages) MICROCHIP

81 / 88 page

DS41213D-page 79

PIC16F5X

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

Lead Pitch

0.80 BSC

Overall Height

–

1.20

Molded Package Thickness

0.95

1.00

1.05

Standoff

0.05

–

0.15

Foot Length

0.45

0.60

0.75

Footprint

1.00 REF

Foot Angle

0°

3.5°

7°

Overall Width

12.00 BSC

Overall Length

12.00 BSC

Molded Package Width

10.00 BSC

Molded Package Length

10.00 BSC

Lead Thickness

0.09

–

0.20

Lead Width

0.30

0.37

0.45

Mold Draft Angle Top

11°

12°

13°

Mold Draft Angle Bottom

11°

12°

13°

NOTE 1

NOTE 2

12 3

Microchip Technology Drawing C04-076B

PIC16F57-I/SP bảng dữ liệu(PDF) 81 Page - Microchip Technology

PIC16F57-I/SP bảng dữ liệu(HTML) 81 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88

bảng dữ liệu tải về

Link URL