PDTA143X_SER_4

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 04 — 16 April 2007

4 of 12

NXP Semiconductors

PDTA143X series

PNP resistor-equipped transistors; R1 = 4.7 k

Ω, R2 = 10 kΩ

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB with 60

µm copper strip line, standard footprint.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB with 60

µm copper strip line, standard footprint.

total power dissipation

PDTA143XE

[1] -

150

mW

PDTA143XK

[1] -

250

mW

PDTA143XM

[2][3] -

250

mW

PDTA143XS

[1] -

500

mW

PDTA143XT

[1] -

250

mW

PDTA143XU

[1] -

200

mW

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 6.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

PDTA143XE

[1] -

-

833

K/W

PDTA143XK

[1] -

-

500

K/W

PDTA143XM

[2][3] -

-

500

K/W

PDTA143XS

[1] -

-

250

K/W

PDTA143XT

[1] -

-

500

K/W

PDTA143XU

[1] -

-

625

K/W