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LVR005 bảng dữ liệu(PDF) 16 Page - Tyco Electronics

tên linh kiện LVR005
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LVR005 bảng dữ liệu(HTML) 16 Page - Tyco Electronics

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Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
LVR/LVRL
Physical Characteristics
Lead material
LVR005-016: Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)
LVR025-040: Tin-plated copper, 0.32mm2 (22AWG), ø0.64mm (0.025in.)
LVR055: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
LVRL: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Devices are not designed to be placed through a reflow process.
LVR/LVRL
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
70°C, 1000 hours
±5%
85°C, 1000 hours
±5%
Humidity aging
85°C, 85%RH, 1000 hours
±5%
Thermal Shock
85°C, -40°C (10 times)
±5%
Solvent resistance
MIL-STD-202, Method 215F
No change
BBRF
Physical Characteristics
Lead material
Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b, can withstand 10 seconds at 260°C ±5°C
Insulting material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
BBRF
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
70°C, 1000 hours
±5%
85°C, 1000 hours
±5%
Humidity aging
85°C, 85%RH, 1000 hours
±5%
Thermal Shock
85°C, -40°C (10 times)
±5%
Solvent resistance
MIL-STD-202, Method 215F
No change
RXEF
Physical Characteristics
Lead material
RXEF005: Tin-plated nickel-copper ally, 0.128mm2 (26AWG), ø0.40mm (0.016in.)
RXEF010: Tin-plated nickel-copper ally, 0.205mm2 (24AWG), ø0.51mm (0.020in.)
RXEF017 to 040: Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.51mm (0.020in.)
RXEF050 to 090: Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)
RXEF110 to 375: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)
Soldering characteristics
Solderability pre ANSI/J-STD-002 Category 3
RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1
Solder heat withstand
RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 5 seconds at 260°C ±5°C
Insulting material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RXEF
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
-40°C, 1000 hours
±5%
85°C, 1000 hours
±5%
Humidity aging
85°C, 85%RH, 1000 hours
±10%
Thermal Shock
85°C, -40°C (10 times)
±10%
Solvent resistance
MIL-STD-202, Method 215F
No change
125
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