PCF8531 datasheet(9/44 Pages) NXP

9 / 44 page

PCF8531_4

Product data sheet

Rev. 04 — 13 June 2008

9 of 44

NXP Semiconductors

PCF8531

34 x 128 pixel matrix driver

C28

132

−2566.4

−821.7

LCD column driver output

C29

133

−2496.4

−821.7

C30

134

−2426.4

−821.7

C31

135

−2356.4

−821.7

C32

136

−2216.4

−821.7

C33

137

−2146.4

−821.7

C34

138

−2076.4

−821.7

C35

139

−2006.4

−821.7

C36

140

−1936.4

−821.7

C37

141

−1866.4

−821.7

C38

142

−1796.4

−821.7

C39

143

−1726.4

−821.7

C40

144

−1656.4

−821.7

C41

145

−1586.4

−821.7

C42

146

−1516.4

−821.7

C43

147

−1446.4

−821.7

C44

148

−1376.4

−821.7

C45

149

−1306.4

−821.7

C46

150

−1236.4

−821.7

C47

151

−1166.4

−821.7

C48

152

−1096.4

−821.7

C49

153

−1026.4

−821.7

C50

154

−956.4

−821.7

C51

155

−886.4

−821.7

C52

156

−816.4

−821.7

C53

157

−746.4

−821.7

C54

158

−676.4

−821.7

C55

159

−606.4

−821.7

C56

160

−534.6

−821.7

C57

161

−466.4

−821.7

C58

162

−396.4

−821.7

C59

163

−326.4

−821.7

C60

164

−256.4

−821.7

C61

165

−186.4

−821.7

C62

166

−116.6

−821.7

C63

167

−46.4

−821.7

C64

168

93.6

−821.7

C65

169

163.6

−821.7

C66

170

233.6

−821.7

Table 5.

Bonding pad description …continued

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 2).

Symbol

Pad

X (

µm)

Y (

µm)

Description

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