PCF2120U datasheet(2/14 Pages) NXP

2 / 14 page

PCF2120_1

Product data sheet

Rev. 01 — 5 February 2008

2 of 14

NXP Semiconductors

PCF2120

Quartz oscillator

Ordering information

[1]

Packing method: sawn wafer on Film Frame Carrier (FFC).

Block diagram

Pinning information

7.1 Pinning

Table 2.

Ordering information

Type

number

Package

Name

Description

Version

PCF2120TK

HVSON10

plastic thermal enhanced very thin small outline

package; no leads; 10 terminals; body 3

× 3 × 0.85 mm

SOT650-1

PCF2120U[1] -

wire bond die; 7 bonding pads; 0.57

× 1.1 × 0.2 mm

PCF2120U

Pin numbers shown for HSVON10 package.

Fig 1.

Block diagram

001aaf631

TEST

VSS

VDD

OSCO

OSCI

CLKOUT

n.c.

CLKOE

1, 4, 6

CL(itg)

PCF2120

Fig 2.

Pin conﬁguration HVSON10

package

Fig 3.

Pad conﬁguration wire bond die

001aaf628

PCF2120TK

n.c.

VSS

TEST

OSCO

CLKOUT

OSCI

VDD

n.c.

CLKOE

Transparent top view

terminal 1

index area

001aah559

OSCO

OSCI

PCF2120U

CLKOE

6VDD

CLKOUT

TEST

VSS

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