PCF2120_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 5 February 2008

9 of 14

NXP Semiconductors

PCF2120

Quartz oscillator

15. Bare die outline

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reflow

soldering description”.

Fig 10. Bare die outline PCF2120U

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

PCF2120U

Wire bond die; 7 bonding pads; 0.57 x 1.1 x 0.2 mm

PCF2120U

07-12-07

08-02-01

UNIT

A

mm

0.212

0.188

D

1.1

E

0.57

0.07

0.06

DIMENSIONS (mm are the original dimensions)

0

0.5

1 mm

scale

A

detail X

D

E

1

2

3

45

6

7

bonding pad 1

corner

X

x

y

0

0

0.07

0.06

Table 7.

Bonding pad coordinates

Values x and y in

µm.

Pad

x

y

1

+313

+187

2

+93

+187

3

−236

+187

4

−259

−172

5

−137

−172

6

+127

−172

7

+380

−172