PCA8575D datasheet(5/30 Pages) NXP

5 / 30 page

PCA8575_2

Product data sheet

Rev. 02 — 21 March 2007

5 of 30

NXP Semiconductors

PCA8575

Remote 16-bit I/O expander for I2C-bus with interrupt

6.2 Pin description

[1]

HVQFN and DHVQFN package die supply ground is connected to both the VSS pin and the exposed center

pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal,

electrical, and board-level performance, the exposed pad needs to be soldered to the board using a

corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias

need to be incorporated in the PCB in the thermal pad region.

Table 2.

Pin description

Symbol

Description

SO24, SSOP24,

TSSOP24, DHVQFN24

HVQFN24

INT

interrupt output (active LOW)

AD1

address input 1

AD2

address input 2

P00

quasi-bidirectional I/O 00

P01

quasi-bidirectional I/O 01

P02

quasi-bidirectional I/O 02

P03

quasi-bidirectional I/O 03

P04

quasi-bidirectional I/O 04

P05

quasi-bidirectional I/O 05

P06

quasi-bidirectional I/O 06

P07

quasi-bidirectional I/O 07

VSS

12[1]

9[1]

supply ground

P10

quasi-bidirectional I/O 10

P11

quasi-bidirectional I/O 11

P12

quasi-bidirectional I/O 12

P13

quasi-bidirectional I/O 13

P14

quasi-bidirectional I/O 14

P15

quasi-bidirectional I/O 15

P16

quasi-bidirectional I/O 16

P17

quasi-bidirectional I/O 17

AD0

address input 0

SCL

serial clock line input

SDA

serial data line input/output

VDD

supply voltage

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