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MIC2829 bảng dữ liệu(PDF) 30 Page - Micrel Semiconductor

tên linh kiện MIC2829
Giải thích chi tiết về linh kiện  3G/4G HEDGE/LTE PMIC with Six Buck Converters, Eleven LDOs and SIM Card Level Translation
PDF  52 Pages
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nhà sản xuất  MICREL [Micrel Semiconductor]
Trang chủ  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2829 bảng dữ liệu(HTML) 30 Page - Micrel Semiconductor

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Micrel Inc.
MIC2829
May 2010
30
M9999-051410-B
Functional Description
AVIN1 and AVIN2
The input supply pins (AVIN1 and AVIN2) provide bias to
the internal LDO circuitry and the input voltage to LDO1
and LDO11. The AVIN operating range is 2.7V to 5.5V
so a minimum 1µF input capacitor with a 6.3V voltage
rating placed as close to the AVIN and ground (AGND1
and AGND2) is required. Capacitance decreases as the
DC bias across the capacitor increases and should be
considered when selecting a suitable capacitor. AVIN1
and AVIN2 are internally connected. All AVINs should be
tied together and connected to the PVINs of the device.
Refer to the layout recommendations for details.
AVIN3 and AVIN4
The input supply pins (AVIN3 and AVIN4) provide bias to
the internal circuitry for the switch mode regulators (DC1
through DC6) and power to SIMPWR. The AVIN
operating range is 2.7V to 5.5V, so a minimum 1µF input
capacitor with a minimum voltage rating of 6.3V placed
close to AVIN and ground (AGND3 and AGND4) is
required. AVIN3 and AVIN4 are internally connected. All
AVINs should be tied together and connected to the
PVINs
of
the
device.
Refer
to
the
layout
recommendations for details.
PVIN1 to PVIN6
The power input supply pins (PVIN1 to PVIN6) provide
power to the switch mode regulators (DC1 to DC6). Due
to high switching currents, a minimum 1µF input
capacitor with a minimum voltage rating of 6.3V placed
close to PVIN and the power ground is required. The
PVIN tracks should be as wide as possible and the 1µF
capacitor should be placed from PVIN1 to PGND1 due
to the proximity of their pin location. The same should be
done with each PVIN and PGND combination. All AVINs
should be tied together and connected to the PVINs of
the device. Refer to the layout recommendations for
details.
AGND1 and AGND2
The ground pins (AGND1 and AGND2) are the ground
path for the biasing, the control circuitry and the power
ground for all LDOs. AGND1 and AGND2 are internally
connected. The current loop for the ground should be
kept as short as possible. Connect AGND1 and AGND2
together. Refer to the layout recommendations for more
details.
AGND3 and AGND4
The analog ground pins (AGND3 and AGND4) are the
ground path for the biasing and the control circuitry for
all buck regulators. This is a low current ground path and
should not be mixed with high current paths such as
PGND. To reduce the effects of parasitic interference in
the layout, AGND3 should be connected to the PGND
plane near the PGND3 pin. Similarly, AGND4 should be
connected to the PGND plane near the PGND4 pin. This
allows the AGND3 and AGND4 ground voltage to be as
close to the PGND ground voltage as possible. Should
the AGND3 and AGND4 connect further from the
PGND3 and PGND4 pins, then the effects of parasitic
inductance
and
resistance
would
reduce
the
performance by altering the accuracy of ground. Refer to
the layout recommendations for more details.
PGND1 to PGND6
The power ground pins (PGND1 to PGND6) are the
ground path for the high current ground path for DC1
through DC6. The current loop for the power ground
should be as small as possible and separate from the
analog ground (AGND3, AGND4) loop. All power
grounds (PGND1 to PGND6) should be connected on
the same plane. Refer to the layout recommendations
for more details.
INLDO
The
INLDO
pins
(INLDO23,
INLDO45,
INLDO6,
INLDO7, INLDO8, and INLDO910) are the power input
for the respective LDOs. Due to line inductance, a
minimum of 1µF input capacitor with a minimum voltage
rating of 6.3V should be placed as close as possible to
the INLDO pin and ground (AGND1, AGND2). Refer to
the layout recommendations for more details.
LDO
The LDO pins (LDO1 to LDO11) are the output of the
LDO and LNR regulators. For LDO1, LDO2, LDO3,
LDO4 and LDO11, a minimum of 1µF output capacitor
with a minimum voltage rating of 6.3V placed as close to
the LDO pin and ground (AGND1 and AGND2) as
possible is required. For the LNRs (LDO5 to LDO10), a
2.2µF output capacitor with a minimum voltage rating of
6.3V placed as close as possible to the LDO pin and
ground (AGND1 and AGND2) is recommended. Refer to
the layout recommendations for more details.
BYP
The reference bypass pin (BYP) acts as a filter for the
reference voltage of LNR5 to LNR10. A 0.1µF bypass
capacitor connected to ground (AGND1 and AGND2) is
recommended.
SUB
The SUB pin (SUB1, SUB2) is connected internally to
the guard ring ground protection. The guard ring
prevents interaction between regulators inside the die
package. Connect SUB1 and SUB2 pins to ground
(AGND1, AGND2) externally.



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