HAL574 datasheet(6/36 Pages) MICRONAS

6 / 36 page

HAL57x, HAL58x

DATA SHEET

Dec. 22, 2008; DSH000145_003EN

Micronas

1.5. Hall Sensor Package Codes

Hall sensors are available in a wide variety of packag-

ing versions and quantities. For more detailed informa-

tion, please refer to the brochure: “Hall Sensors:

Ordering Codes, Packaging, Handling”.

1.6. Solderability and Welding

Solderability

During

soldering

reflow

processing

and

manual

reworking, a component body temperature of 260 °C

should not be exceeded.

Welding

Device terminals should be compatible with laser and

resistance welding. Please note that the success of

the welding process is subject to different welding

parameters which will vary according to the welding

technique used. A very close control of the welding

parameters is absolutely necessary in order to reach

satisfying results. Micronas, therefore, does not give

any implied or express warranty as to the ability to

weld the component.

Fig. 1–4: Pin configuration

HALXXXPA-T

Temperature Range: K or E

Package: SF for SOT89B-1

UA for TO92UA

Type: 57x or 58x

Example: HAL581UA-E

→ Type: 581

→ Package: TO92UA

→ Temperature Range: T

J = −40 °C to +100 °C

1 VDD

2,4

GND

x = pin 3 for TO92UA-1/-2 package

x = pin 4 for SOT89B-1 package

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