HAL575SF-K datasheet(34/36 Pages) MICRONAS

34 / 36 page

HAL57x, HAL58x

DATA SHEET

Dec. 22, 2008; DSH000145_003EN

Micronas

5.4. Ambient Temperature

Due to internal power dissipation, the temperature on

the silicon chip (junction temperature TJ) is higher than

the temperature outside the package (ambient temper-

ature TA).

At static conditions and continuous operation, the fol-

lowing equation applies:

For all sensors, the junction temperature range TJ is

specified. The maximum ambient temperature TAmax

can be calculated as:

For typical values, use the typical parameters. For

worst case calculation, use the max. parameters for

IDD and Rth, and the max. value for VDD from the appli-

cation.

Due to the range of IDDhigh, self-heating can be critical.

The junction temperature can be reduced with pulsed

supply voltage. For supply times (ton) ranging from 30

μs to 1 ms, the following equation can be used:

5.5. EMC and ESD

For applications with disturbances on the supply line or

radiated disturbances, a series resistor and a capacitor

are recommended (see Fig. 5–3). The series resistor

and the capacitor should be placed as closely as pos-

sible to the HAL sensor.

Applications with this arrangement passed the EMC

tests according to the product standards ISO 7637.

Please contact Micronas for detailed information and

first EMC and ESD results.

Fig. 5–3: Recommded EMC test circuit

ΔT

ΔTI

Amax

Jmax

ΔT

–

off

--------------------

1 VDD

2, x GND

x = pin 3 for TO92UA-1/-2 package

x = pin 4 for SOT89B-1 package

VEMC

4.7 nF

RV2

RV1

100

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