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SG109 bảng dữ liệu(PDF) 2 Page - Microsemi Corporation |
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SG109 bảng dữ liệu(HTML) 2 Page - Microsemi Corporation |
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2 / 3 page ![]() SG109/SG309 4/90 Rev 1.1 2/94 LINFINITY Microelectronics Inc. Copyright © 1994 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 Input Voltage ........................................................................ 35V Power Dissipation ........................................... Internally Limited Storage Temperature Range ............................. -65 °C to 150°C ABSOLUTE MAXIMUM RATINGS (Note 1) Note 1. Exceeding these ratings could cause damage to the device. K Package: Thermal Resistance-Junction to Case, θ JC ................. 3.0°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 35°C/W R Package: Thermal Resistance-Junction to Case, θ JC ................. 5.0°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 40°C/W IG Package: Thermal Resistance-Junction to Case, θ JC ................. 3.5°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 42°C/W T Package: Thermal Resistance-Junction to Case, θ JC .................. 15°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 120°C/W THERMAL DATA Input Voltage Range ............................................... 7.0V to 25V Note 2. Range over which the device is functional. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG109 with -55°C ≤ T A ≤ 150°C, SG309 with 0°C ≤ T A ≤ 125°C, and for V IN = 10V, I OUT = 500mA (K, R, and IG -Power Packages-) and I OUT = 100mA (T-package). Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) RECOMMENDED OPERATING CONDITIONS (Note 2) Units SG309 SG109 Parameter Test Conditions T A = 25°C V IN = 7.1V to 25V, TA = 25°C T A = 25°C Power Pkgs: I OUT = 5mA to 1.5A T-package: I OUT =5mA to 500mA V IN= 7.4V to 25V Power Pkgs: I OUT = 5mA to 1.0A, P ≤ 20W T-package: I OUT =5mA to 200mA, P ≤ 20W V IN = 7.4V to 25V With Line : V IN = 7.4V to 25V With Load: Power Pkgs: I OUT = 5mA to 1.0A T-package: I OUT =5mA to 200mA f = 10Hz to 100KHz, T A = 25°C T A = 25°C Output Voltage Line Regulation Load Regulation Total Output Voltage Tolerance Quiescent Current Quiescent Current Change Output Noise Voltage Long Term Stability Ripple Rejection 4.7 4.6 4.6 50 5.05 4.0 15 15 5.0 5.0 40 10 5.3 50 100 50 5.4 5.4 10 0.5 0.8 0.8 4.8 4.75 4.75 50 5.05 4.0 15 15 5.00 5.00 40 20 5.2 50 100 50 5.25 5.25 10 0.5 0.8 0.8 V mV mV mV V V mA mA mA mA µV mV dB Min. Max. Typ. Min. Typ. Max. Operating Junction Temperature Range SG109 ............................................................ -55°C to 150°C SG309 ............................................................... 0°C to 125°C Operating Junction Temperature Hermetic (K, R, T, IG-Packages) .................................. 150 °C Lead Temperature (Soldering, 10 Seconds) ................ 300 °C Note A. Junction Temperature Calculation: T J = T A + (P D x θ JA ). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mount- ing configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/ pc-board system. All of the above assume no ambient airflow. |
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