POWERMITE

TM

Low Noise 1 Watt Zener Diodes

S C O T TS DALE DIVISION

1PMT4614e3 thru 1PMT4627e3,

1PMT4099e3 thru 1PMT4135e3

DESCRIPTION

APPEARANCE

This Microsemi Powermite

provides a higher power handling capability that are also RoHS compliant.

In addition to its size advantages, Powermite

full-metallic bottom that eliminates the possibility of solder flux entrapment

during assembly, and a unique locking tab acts as an efficient heat path

from die to mounting plane for external heat sinking with very low thermal

resistance junction to case (bottom).

Its innovative design makes this

device ideal for use with automatic insertion equipment.

DO-216

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Surface mount equivalent to JEDEC registered

1N4099 thru 1N4135 and 1N4614 thru 1N4627

series except with additional power capability

•

Extensive selection from 1.8 to 100 V

•

Regulates voltage over a broad operating current and

temperature range

•

Low noise density (1-3 kHz) at test current

•

Low reverse leakage current

•

RoHS compliant

•

Tight tolerances available in plus or minus 2% or 1%

with C or D suffix respectively

•

Moisture classification Level 1 per IPC/JEDEC

J-STD-020B with no dry pack required

•

Nonsensitive to ESD per MIL-STD-750 Method 1020

•

Compatible with automatic insertion equipment

•

Full metallic bottom eliminates flux entrapment

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Operating and Storage Temperatures: -55

°C to +150°C

•

mounted on FR4 PC board as described for thermal

resistance (also see power deratings in Figure 1)

•

Thermal Resistance: 30°C/W junction to case

(bottom) and 240°C/W junction to ambient on FR4

PC board (1 oz copper) with recommended footprint

(see last page)

•

Forward voltage: 1.1 Volts @ 200 mA

•

Solder Temperatures: 260°C for 10 s (max)

•

CASE: Void-free transfer molded thermosetting epoxy

compound meeting UL94V-0

•

FINISH: Annealed matte-Tin plating over copper and

readily solderable per MIL-STD-750 method 2026

(consult factory for Tin-Lead plating)

•

POLARITY: Cathode designated by Tab 1 (bottom)

•

MARKING: Three numerical digits of P/N and a dot

(see next page listing)

•

WEIGHT: 0.016 grams (approx.)

•

Package dimensions on last page

•

Tape & Reel option: Standard per EIA-481-B

3000 on 7 inch reel and 12,000 on 13” reel

Microsemi

Scottsdale Division

Page 1

Copyright

© 2007

10-15-2007 REV J

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503