PAS6311LT Specification

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PixArt Imaging Inc.

v1.5 2007/10/02

Recommended Condition For Infrared Reflow

Carefully observe the mounting conditions, recommended temperature profile when

Mounting infrared reflows is show in the figure below.

After mounting on the mother board, it must be dispense epoxy in side of the CSP package.

☉ Reflow Profile

Recommend Pb-free solder paste vender & type :

1. Almit LFM-48W TM-HP

2. Senju M705-GRN360-K

☉ Dispense Epoxy

Recommend Reflow Profile

0

50

100

150

200

250

0

20

40

60

80

100

120

140

160

180

200

220

Time

Pre-heat

Melting area

( Sec )

Programming

rate

1.5~2.5

Pre-heat

170~200

90 +/- 30 sec

Melting area

>220

with peak temperature 230~245

Epoxy