TL(RH,RMH,SH,OH,YH)1102B(T10)

2006-07-07

9

Packaging

These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent

moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air

before soldering and they should therefore be stored under the following conditions:

1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.

Temperature: 5

°C~30°C

Humidity: 90% (max)

2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an

environment of 5°C to 30°C/60% RH or below.

3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color

changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.

After baking, use the baked devices within 72 hours, but perform baking only once.

Baking conditions: 60

±5°C, for 12 to 24 hours.

Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.

4. Repeated baking can cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be

sure to prevent damage to the device from static electricity during the baking process.

5. Any breakage in the laminate packing material will cause the hermeticity of the product to deteriorate. Do

not toss or drop the packed devices.

Mounting Method

Soldering

• Reflow soldering

• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the

condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under

the above conditions.

• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of

opening the package.

• Second reflow soldering

In case of second reflow soldering should be performed within 168 h of the first reflow under the above

conditions.

Storage conditions before the second reflow soldering: 30

°C, 60% RH (max)

• Make any necessary soldering corrections manually.

(only once at each soldering point)

Soldering iron

: 25 W

Temperature

: 300

°C or less

Time

: within 3 s

• Do not perform wave soldering.

Recommended soldering pattern

1.65

1.15

2.41

Unit: mm

1.65

(*)

60~120 s max

10 s max

240

°C max

4

°C/s max

140~160

°C max

4

°C/s max

Time (s)

Temperature profile (example)

(*)

(*)

(*)

(*)

(*)