TL(RM,RMM,SM,OM,YM)1052(T20)

2009-07-23

10

Recommended soldering pattern

Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our dipping

tests (carried out under the recommended conditions) confirm that these solvents have no effect on

semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account the

cleaning conditions and usage conditions.

Cleaning Solvent

Manufacturer

ASAHI CLEAN AK-225AES

ASAHI GLASS

KAO CLEAN THROUGH 750H

KAO

PINE ALPHA ST-100S

ARAKAWA CHEMICAL

Precautions When Mounting

Do not apply force to plastic parts of the LED under high-temperature conditions.

The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.

When installing the PCB in a product, ensure that the device does not come into contact with other components.

This product doesn't apply mounting that solder flow. Please mount on recommended reflow solder mounting condition.

Tape Specifications

1. Product number format

The type of package used for shipment is denoted by a symbol suffix after the product number. The method of

classification is as below. (This method, however, does not apply to products whose electrical characteristics

differ from standard Toshiba specifications.)

(1)

Tape Type: T20 (8-mm pitch)

(2)

Example

Tape type

2. Handling precautions

Tape material protected against static electricity. However, static electricity may occur depending on

quantity of charged static electricity and a device may attach to a tape, or a device may be unstable

when peeling a tape cover.

(a) In process, taping materials may sustain an electrostatic charge, use an ionizer to

neutralize the ions.

(b) For transport and temporary storage of devices, use containers(boxes, jigs, and bags)

that are made of anti-static materials or of materials that dissipate electrostatic electricity.

2.45

1.3

2.7

Unit: mm

2.45

TLSM1052

(T20)

Toshiba product No.