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AS5145

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 7 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

-0.3

7

V

5

V

Input pin voltage

-0.3

+0.3

V

Input current (latchup immunity)

-100

100

mA

Norm: EIA/JESD78 Class II Level A

Electrostatic discharge

± 2

kV

Norm: JESD22-A114E

Storage temperature

-55

125

ºC

Min – 67ºF; Max +257ºF

Package Body temperature

260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020C

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%