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AS1153/55

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-

tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

-0.3

+5.0

V

INx+, INx- to GND

-0.3

+5.0

V

OUTx to GND

-0.3

V

Thermal Resistance

128

ºC/W

Typical 4-layer application

Storage Temperature Range

-65

+150

ºC

Maximum Junction Temperature

+150

ºC

Operating Temperature Range

-40

+85

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering

temperature (body temperature)

specified is in compliance with

IPC/JEDEC J-STD-020C

“Moisture/ Reflow Sensitivity

Classification for Non-Hermetic

Solid State Surface Mount

Devices”.

ESD Protection

-4

+4

kV

Human Body Model, INx+, INx-