AD9575 datasheet(7/16 Pages) AD

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AD9575

Rev. 0 | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 9.

Parameter

Rating

VDD, VDDA, VDDX, VDD_CMOS to GND

−0.3 V to +3.6 V

XO1, XO2 to GND

−0.3 V to VS + 0.3 V

LVDS/LVPECL OUT, LVDS/LVPECL OUT,

CMOS OUT/SEL1 to GND

−0.3 V to VS + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

1 See Table 10 for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 10. Thermal Resistance1

Package Type

θJA

Unit

16-Lead TSSOP

90.3

°C/W

1 Thermal impedance measurements were taken on a 4-layer board in still air

in accordance with EIA/JESD51-7.

ESD CAUTION

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