SW003A5F datasheet(21/24 Pages) LINEAGEPOWER

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Data Sheet

December 12, 2008

SW/SC001/003 Series DC-DC Power Module:

18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current

LINEAGE POWER

The SW/SC family of power modules is available for

either Through-Hole (TH) or Surface Mount (SMT)

soldering.

Through-Hole Soldering Information

The RoHS-compliant (Z codes) through-hole products

use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-

compliant components. They are designed to be

processed through single or dual wave soldering

machines. The pins have an RoHS-compliant finish

that is compatible with both Pb and Pb-free wave

soldering processes. A maximum preheat rate of

°C/s is suggested. The wave preheat process

should be such that the temperature of the power

module board is kept below 210

°C. For Pb solder,

the recommended pot temperature is 260

°C, while the

Pb-free solder pot is 270

°C max. Not all RoHS-

compliant through-hole products can be processed

with paste-through-hole Pb or Pb-free reflow process.

If additional information is needed, please consult with

your Lineage Power representative for more details.

Surface Mount Information

Pick and Place

The SW/SC-SR series of DC-to-DC power converters

use an open-frame construction and are designed for

surface mount assembly within a fully automated

manufacturing process.

The SW/SC-SR series modules are designed to use

the main magnetic component surface to allow for

pick and place.

12.70

Ø6.5 NOZZLE.

Note: All dimensions in mm.

Figure 52. Pick and Place Location.

Z Plane Height

The ‘Z’ plane height of the pick and place location is

7.50mm nominal with an RSS tolerance of +/-0.25

mm.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, they have a

relatively large mass when compared with

conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and placement

speed should be considered to optimize this process.

The minimum recommended nozzle diameter for

reliable operation is 5mm. The maximum nozzle outer

diameter, which will safely fit within the allowable

component spacing, is 6.5mm.

Oblong or oval nozzles up to 11 x 6 mm may also be

used within the space available.

For further information please contact your local

Lineage Power Technical Sales Representative.

Reflow Soldering Information

These power modules are large mass, low thermal

resistance devices and typically heat up slower

than other SMT components. It is recommended

that the customer review data sheets in order to

customize the solder reflow profile for each

application board assembly.

The following instructions must be observed when

SMT soldering these units. Failure to observe

these instructions may result in the failure of or

cause damage to the modules, and can adversely

affect long-term reliability.

The surface mountable modules in the SW/SC

family use our SMT technology called “Column Pin”

(CP) connectors. Figure 53 shows the CP

connector before and after reflow soldering onto the

end-board assembly.

Power Module Board

Insulator

Solder Ball

End assembly PCB

Figure 53. Column Pin Connector Before and

After Reflow Soldering.

The CP is constructed from a solid copper pin with an

integral solder ball attached, which is composed of

tin/lead (Sn63/Pb37) solder for non-Z codes, or

Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP

connector design is able to compensate for large

amounts of co-planarity and still ensure a reliable

SMT solder joint. Typically, the eutectic solder melts

at 183

oC (Sn/Pb solder) or 217-218 oC (SAC solder),

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint.

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