LSR2040 datasheet(5/5 Pages) LIGITEK

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Thermal Shock Test

Solder Resistance

Test

Solderability Test

High Temperature

High Humidity Test

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202:103B

JIS C 7021: B-11

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

1.Ta=65℃±5℃

2.RH=90 %~95%

3.t=240hrs ±2hrs

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

This test intended to see soldering well

performed or not.

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

The purpose of this test is the resistance

of the device under tropical for hous.

PART NO. LSR2040

Low Temperature

Storage Test

Test Item

Operating Life Test

High Temperature

Storage Test

Reliability Test:

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=-40 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Test Condition

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

The purpose of this is the resistance of

the device which is laid under ondition

of hogh temperature for hours.

Description

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