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LT6350CDDPBF bảng dữ liệu(PDF) 21 Page - Linear Technology

tên linh kiện LT6350CDDPBF
Giải thích chi tiết về linh kiện  Low Noise Single-Ended to Differential Converter/ADC Driver
PDF  28 Pages
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LT6350CDDPBF bảng dữ liệu(HTML) 21 Page - Linear Technology

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LT6350
21
6350f
APPLICATIONS INFORMATION
BOARD LAYOUT AND BYPASS CAPACITORS/DC1538A
DEMOBOARD
For single-supply applications it is recommended that
a high quality X5R or X7R, 0.1μF bypass capacitor be
placed directly between the V+ and the V– pin; the V– pin
(including the Exposed Pad on the DD8 package) should be
tied directly to a low impedance ground plane with minimal
routing. For split power supplies, it is recommended that
additional high quality X5R or X7R, 0.1μF capacitors
be used to bypass pin V+ to ground and V– to ground,
again with minimal routing. Small geometry (e.g., 0603)
surface mount ceramic capacitors have a much higher
self-resonant frequency than do leaded capacitors, and
perform best with the LT6350.
The +IN2 pin should be bypassed to ground with a high
quality ceramic capacitor of at least 0.1μF, both to reduce
the noise bandwidth of the recommended DC offset balance
resistor and to prevent changes in the common mode
reference voltage from being converted into a differential
output signal.
Stray parasitic capacitance at the –IN1 pin should be kept
to a minimum to prevent degraded stability resulting in
excessive ringing or oscillations. Traces at –IN1 should be
kept as short as possible, and any ground plane should
be stripped from under the pin and pin traces.
Because the outputs operate differentially, load imped-
ances seen by both outputs (stray or intended) should
be as balanced and symmetric as possible. This will help
preserve the balanced operation that minimizes the gen-
eration of even-order harmonic distortion in the output
stage and maximizes the rejection of common mode
signals and noise.
The DC1538A demoboard has been designed for the
evaluation of the LT6350 following the above layout prac-
tices. Its schematic and component placement are shown
in Figures 9 and 10.



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