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LHG35162-R1-PF bảng dữ liệu(PDF) 7 Page - LIGITEK electronics co., ltd.

tên linh kiện LHG35162-R1-PF
Giải thích chi tiết về linh kiện  BIPOLAR TYPE LED LAMPS
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nhà sản xuất  LIGITEK [LIGITEK electronics co., ltd.]
Trang chủ  http://www.ligitek.com
Logo LIGITEK - LIGITEK electronics co., ltd.

LHG35162-R1-PF bảng dữ liệu(HTML) 7 Page - LIGITEK electronics co., ltd.

  LHG35162-R1-PF Datasheet HTML 1Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 2Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 3Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 4Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 5Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 6Page - LIGITEK electronics co., ltd. LHG35162-R1-PF Datasheet HTML 7Page - LIGITEK electronics co., ltd.  
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Reference
Standard
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Description
Test Condition
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
MIL-STD-883:1008
JIS C 7021: B-10
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Test Item
Operating Life Test
High Temperature
Storage Test
Reliability Test:
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
The purpose of this test is the resistance
of the device under tropical for hours.
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to see soldering well
performed or not.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=65
℃±5℃
2.RH=90 %~95%
3.t=240hrs
±2hrs
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
JIS C 7021: B-12
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
MIL-STD-202:103B
JIS C 7021: B-11
Low Temperature
Storage Test
High Temperature
High Humidity Test
Thermal Shock Test
Solder Resistance
Test
Solderability Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
PART NO. LHG35162/R1-PF



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