SSC-QP-7-07-24 (Rev.00)

Rev. 01

Rev. 01

October 2009

October 2009

www.

.com

Lead Solder

2.5~5 C / sec.

o

o

o

Pre-heating

120~150 C

120sec. Max.

60sec. Max.

Above 200 C

o

240 C Max.

10 sec. Max.

2.5~5 C / sec.

11. Soldering

(1) Lead Solder

10 sec. Max.

Soldering time Condition

240℃ Max.

Peak-Temperature

120 sec. Max.

Pre-heat time

120~150℃

Pre-heat

Lead Solder

(2) Lead-Free Solder

(3) Hand Soldering conditions

Do not exceed 4 seconds at maximum 315ºC under soldering iron.

[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products.

(4) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter,

the picking up nozzle that does not affect the silicone resign should be used.

Lead-free Solder

1~5 C / sec.

o

o

o

1~5 C / sec.

Pre-heating

150~200 C

120sec. Max.

Above 220 C

o

260 C Max.

10 sec. Max.

10 sec. Max.

Soldering time Condition

260℃ Max.

Peak-Temperature

120 sec. Max.

Pre-heat time

150~200℃

Pre-heat

Lead Free Solder

o

60sec. Max.