Data Sheet

9

Rev. 1.1, 2009-07-07

TLE 8444SL

General Product Characteristics

4.2

Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

Supply Voltage Range for

Normal Operation

V

S(nor)

818

V

–

4.2.2

Extended Supply Voltage Range

for Operation

V

S(ext)

V

UV OFF

V

OV OFF

V

Limit values,

deviations possible;

After

V

V

UV ON

4.2.3

Supply voltage increasing

V

S

-0.3

V

UV ON

V

Outputs are open

4.2.4

Supply voltage decreasing

V

S

-0.3

V

UV OFF

V

Outputs are open

4.2.5

Logic input voltages

(IN1; IN2; IN3; IN4; INH)

V

IN(1-4)

V

INH

-0.3

5.5

V

–

4.2.6

Junction temperature

T

j

-40

150

°C–

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.1

1) Not subject to production test, specified by design

R

thJSP

––26

K/W

2) Specified RthJS value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).

Ta=25°C, LS1+HS2+LS3+HS4 are dissipating 1W (0.25W each).

4.3.2

Junction to Ambient1)

R

thJA

–60

–

K/W

3)

3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Ta=25°C, LS1+HS2+LS3+HS4 are dissipating 1W (0.25W each).