MXHV9910

10

www.clare.com

R01

3. Manufacturing Information

3.1 Mechanical Dimensions

Note: Thermal pad should be electrically connected to GND, pin 3.

8-Pin SOIC Package

Recommended PCB Land Pattern

Dimensions

mm

(inches)

PIN 1

0.33 - 0.51

(0.013 - 0.020)

5.80 - 6.20

(0.23 - 0.24)

3.80 - 4.00

(0.15 - 0.16)

1.27 TYP

(0.05 TYP)

0.40 - 1.27

(0.016 - 0.050)

0.19 - 0.25

(0.008 - 0.010)

1.35 - 1.75

(0.053 - 0.069)

0.10 - 0.25

(0.004 - 0.010)

4.80 - 5.00

(0.19 - 0.20)

0.394 - 0.648

(0.016 - 0.026)

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

8-Pin SOIC Package with Exposed Thermal Pad

Recommended PCB Land Pattern

Dimensions

mm

(inches)

PIN 1

0.33 - 0.51

(0.013 - 0.020)

5.80 - 6.20

(0.23 - 0.24)

3.80 - 4.00

(0.15 - 0.16)

1.27 TYP

(0.05 TYP)

0.40 - 1.27

(0.016 - 0.050)

0.19 - 0.25

(0.008 - 0.010)

1.35 - 1.75

(0.053 - 0.069)

0.00 - 0.13

(0.000 - 0.005)

4.80 - 5.00

(0.19 - 0.20)

0.394 - 0.648

(0.016 - 0.026)

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

2.40

(0.09)

2.40

(0.09)

2.032 - 2.413

(0.080 - 0.095)

2.032 - 2.413

(0.080 - 0.095)