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ADP122AUJZ-2.85-R7 bảng dữ liệu(PDF) 16 Page - Analog Devices |
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ADP122AUJZ-2.85-R7 bảng dữ liệu(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP122/ADP123 Rev. 0 | Page 16 of 20 140 120 100 80 60 40 20 0 VIN – VOUT (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 50mA ILOAD = 100mA ILOAD = 150mA ILOAD = 250mA ILOAD = 300mA TJ MAX 0.4 0.8 1.2 1.6 2.0 2.4 2.8 Figure 40. Junction Temperature vs. Power Dissipation, Board Temperature = 85°C PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP122/ADP123. However, as shown in Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. The input capacitor should be placed as close as possible to the VIN and GND pins, and the output capacitor should be placed as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where the area is limited. |
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